| 摘要 |
PROBLEM TO BE SOLVED: To provide a device which inhibits electric short circuit between interconnections in order to reduce interconnection conduction failures, and to provide a board adhering method. SOLUTION: The device is composed a plurality of boards adhered together. The device includes a first board having first interconnections arranged therein, a second board having second interconnections arranged therein, a covering material arranged on portions between the first interconnections, and an adhesive adhering the first board to the second board. The covering material covers the portions between the first interconnections. COPYRIGHT: (C)2008,JPO&INPIT
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