| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of holding a silicon wafer capable of preventing the silicon wafer from bending when a rear face of the wafer is held, and reducing a flaw caused by contact with a supporting member when the rear face of the wafer is held. SOLUTION: The rear face of the silicon wafer with a diameter of 300 mm or more and a thickness of 700 to 1,000μm is held in contact by the supporting member or a sucking member in a range of a radius of the wafer multiplied by 0.50 to 0.80 from the center of the wafer. The wafer is held with the in-plane maximum displacement of the wafer of 300μm or less. Throughout processes for holding the rear face of the silicon wafer in contact by the supporting member or the sucking member, the rear face of the wafer is held in contact within the holding range. COPYRIGHT: (C)2008,JPO&INPIT
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