发明名称 INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THEREOF
摘要 An integrated circuit and a manufacturing method thereof are provided to maximize a capacitor region without increasing a layout area by forming a laminated capacitor on an upper portion of a DRAM chip. An integrated circuit includes a cell array region(D) having a capacitor, and a peripheral circuit region(E) formed around the cell array region. A ferroelectric capacitor region(E) is formed on an upper layer of the cell array region and the peripheral circuit region, and has a ferroelectric capacitor device. A pump capacitor used in a pump circuit of the peripheral circuit region, a decoupling capacitor used in an output terminal of the pump circuit of the peripheral circuit region, and a decoupling capacitor used in a power terminal of the peripheral circuit region are used as the ferroelectric capacitor device.
申请公布号 KR20070104211(A) 申请公布日期 2007.10.25
申请号 KR20070015440 申请日期 2007.02.14
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KANG, HEE BOK
分类号 H01L27/10 主分类号 H01L27/10
代理机构 代理人
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