发明名称 GATE STRUCTURE OF INTEGRATED CIRCUIT MEMORY DEVICE HAVING CHARGE STORING NANO CRYSTALS IN METAL OXIDE DIELECTRIC FILM AND METHOD OF FORMING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a gate structure of an integrated circuit memory device having charge storing nano crystals in a metal oxide dielectric film and a method of forming the gate structure. <P>SOLUTION: The method of forming a gate structure of an integrated circuit memory device includes forming a metal oxide dielectric film 150 on an integrated circuit substrate 100. Ions of an element selected from group IV of the periodic table and having a thermal diffusivity no larger than 0.5 cm<SP>2</SP>/s, such as Ge, are injected into the dielectric film to form a charge storing region in the dielectric film with a tunnel dielectric film 135 formed under the charge storing region and a capping dielectric film 140 formed on the charge storing region. The substrate 100 including the dielectric film 150 is thermally treated to form a plurality of discrete charge storing nano crystals 130_NC in the charge storing region. A gate electrode layer 160 is formed on the dielectric film 150. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281470(A) 申请公布日期 2007.10.25
申请号 JP20070097661 申请日期 2007.04.03
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHOI SAM-JONG;CHO KYOO-CHUL;CHOI SOO-YEOL;KIM YONG-KWON;PARK YOUNG-SOO;IN SANKOKU;PARK HAE-JIN;KIM SANG-SIK
分类号 H01L21/8247;H01L21/8242;H01L27/108;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
代理机构 代理人
主权项
地址