发明名称 ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE FABRICATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component which allows a reliable electric connection via a projection electrode with an underfill material applied. <P>SOLUTION: This electronic component comprises a projection electrode 5 composed of conductive materials and a dummy projection 6 taller than the projection electrode 5 on a substrate 2. A number of dummy projections 6 are created outside of an area having the projection electrode 5, each having a height nearly equal to that of the projection electrode. The melting point of each projection 6 lies in a temperature range except the melting point of the projection electrode 5. In addition, when the projection electrode 5 is connected to the outside, electronic component position information can be detected via the projection 6. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281393(A) 申请公布日期 2007.10.25
申请号 JP20060109455 申请日期 2006.04.12
申请人 SONY CORP 发明人 MAKITA YOSHIHIRO;WAKIYAMA SATORU
分类号 H01L21/60 主分类号 H01L21/60
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