| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic package for containing an electronic component which can increase the adhesive strength of pads, whether they are bonded with a conductive adhesive or by solder, and to provide its manufacturing method. <P>SOLUTION: The ceramic package 10 for containing an electronic component includes connection terminal pads 14 to which electronic components 19 are to be bonded via a conductive adhesive 20 consisting of a mixture of a conductive metal and an adhesive resin and external connection terminal pads 15 to be bonded to the outside via a solder 24. On the surface of these pads, an Ni plating coating film 17 and an Au plating coating film 18 are formed by an electrolytic plating method. About the Au plating coating film 18, a quantitative value for CN is 2 or below when Au in a residue of a component which constitutes an Au plating bath liquid attaching to the surface of the Au plating coating film 18 measured by TOF-SIMS is 1, a quantitative value for AuC<SB>2</SB>N<SB>2</SB>is 0.5 or below, and a quantitative value for amines is 0.2 or below. <P>COPYRIGHT: (C)2008,JPO&INPIT |
