| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a magnetic head assembly capable of strongly bonding the electrode pad of a slider and the electrode pad of a flexible wiring board by a simple process. <P>SOLUTION: In the magnetic head assembly for soldering an electrode pad for a magneto-resistance effect element exposed to a slider surface to the electrode pad of a flexible wiring board for connecting the magneto-resistance effect element to an external circuit, the slider electrode pad is formed on an electric wiring layer connected to the magneto-resistance effect element, an Au surface protective layer is exposed to a solder contact surface, a Cu adhesive layer is formed between the Au surface protective layer and and the electric wiring layer, and the thickness of the Cu adhesive layer before soldering is defined so that the thickness after the soldering is equal to or more than 0.05μm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
