| 摘要 |
A test apparatus for semiconductor elements on a semiconductor wafer has test probes in a test area, which are held by a needle card. The needle card is held by a test area housing which surrounds the test area. Pressure is applied to the test area, and the test area housing floats on an air cushion above the semiconductor wafer. The test area housing has at least three distance sensors, which detect the width of a gap between the test area housing and the semiconductor wafer upper face, and interact with at least three gap control elements. The gap control elements are supported against a stiff test apparatus plate and maintain a predetermined gap width, while the semiconductor wafer is arranged on a test table of the test apparatus.
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