Semiconductor integrated circuit and method of designing semiconductor integrated circuit

摘要

A semiconductor integrated circuit has: a power pad placed on a chip; and a circuit group connected to the power pad through a power wiring structure. The power wiring structure includes: a plurality of first power wirings and a plurality of second power wirings that are formed in different wiring layers and overlap with each other at a plurality of intersections; and vias connecting the plurality of first power wirings and the plurality of second power wirings. The circuit group includes a first functional block placed on a first region. The vias are not placed at a part of the plurality of intersections within a second region located between the first region and the power pad.