发明名称 |
BONDED COMPOSITE OF SILICONE RESIN AND EPOXY RESIN AND A METHOD FOR MANUFACTURING THEREOF |
摘要 |
An firmly bonded composite of a silicone resin and an epoxy resin comprising: (A) a curable silicone resin composition comprising: (A1) an organopolysiloxane resin that has a refractory index within the range of 1.45 to 1.60 and contains at least two silicon-bonded alkenyl groups having 2 to 12 carbon atoms, and not less than 30 mole percent of total siloxane units is phenylsiloxane units represented by the following formula: C6H5-SiO3/2, (A2) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms and(A3) hydrosilylation catalyst, and (B) a curable epoxy resin composition comprising:(B1) an epoxy resin that contains at least two epoxy groups in one molecule, (B2) a curing agent, and (B3) a curing catalyst. The firmly bonded composite is obtained only by curing composition (A) and composition (B) in tight contact with each other. |
申请公布号 |
KR20070104373(A) |
申请公布日期 |
2007.10.25 |
申请号 |
KR20077017522 |
申请日期 |
2005.12.22 |
申请人 |
DOW CORNING TORAY CO., LTD. |
发明人 |
NAKASHIMA HISATAKA;KOBAYASHI HIDEKI |
分类号 |
C08L83/04;B32B25/20;C08J5/12;C08L63/00 |
主分类号 |
C08L83/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|