发明名称 BONDED COMPOSITE OF SILICONE RESIN AND EPOXY RESIN AND A METHOD FOR MANUFACTURING THEREOF
摘要 An firmly bonded composite of a silicone resin and an epoxy resin comprising: (A) a curable silicone resin composition comprising: (A1) an organopolysiloxane resin that has a refractory index within the range of 1.45 to 1.60 and contains at least two silicon-bonded alkenyl groups having 2 to 12 carbon atoms, and not less than 30 mole percent of total siloxane units is phenylsiloxane units represented by the following formula: C6H5-SiO3/2, (A2) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms and(A3) hydrosilylation catalyst, and (B) a curable epoxy resin composition comprising:(B1) an epoxy resin that contains at least two epoxy groups in one molecule, (B2) a curing agent, and (B3) a curing catalyst. The firmly bonded composite is obtained only by curing composition (A) and composition (B) in tight contact with each other.
申请公布号 KR20070104373(A) 申请公布日期 2007.10.25
申请号 KR20077017522 申请日期 2005.12.22
申请人 DOW CORNING TORAY CO., LTD. 发明人 NAKASHIMA HISATAKA;KOBAYASHI HIDEKI
分类号 C08L83/04;B32B25/20;C08J5/12;C08L63/00 主分类号 C08L83/04
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