METHOD OF MANUFACTURING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board which can prevent holes formed through a circuit board from being closed with machining chips. SOLUTION: This method of manufacturing a circuit board comprises the processes of: a hole forming process in which a pass-through hole 18 is formed through an insulating substrate 10 which contains a resin composition; and then a heating process in which the insulating substrate 10 is heated to a temperature higher than the heat-softening temperature and lower than the heat-hardening temperature of the insulating substrate 10. COPYRIGHT: (C)2008,JPO&INPIT