| 摘要 |
PROBLEM TO BE SOLVED: To provide a fabrication method for a film carrier tape used for BGA, a press machine equipped with a metal punch and die, and the film carrier tape used for BGA, which are enhancing an adhesiveness of a soldering ball to a land, and enhancing a flow property of a solder in a via hole simply by a mechanical treatment method. SOLUTION: Paying attention to the experimental result that an indentation remains aslant as it is even after a stress is released, if a periphery part of the via hole formed in an insulation tape is suppressed mechanically. In the mechanical metallic mold press treatment which forms the via hole 26 for the via hole 4 in an insulation tape 2 by a punch 27 for perforation, a periphery part 26a of the via hole 26 is suppressing mechanically by a punch 35 for pressing down by opposite side of a land side 5, an expanding shape part 4b which an inner diameter expands to the periphery part 26a of the via hole 26 gradually towards a front surface is formed as the indentation. COPYRIGHT: (C)2008,JPO&INPIT
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