| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser enabling improvement of heat dissipation performance at low cost to solve the problem that a conventional heat dissipation measure has been carried out through enlargement of a submount carrying a semiconductor element or changing of the material of the submount to one that has better heat dissipation characteristics. SOLUTION: The semiconductor laser includes a light-emitting element, and a mounting member carrying the light-emitting element mounted thereon. The mounting member is provided with a cutout so as not to interfere with light emitted from the light-emitting element. Thus, the semiconductor laser enabling improvement of heat dissipation performance at low cost can be obtained. COPYRIGHT: (C)2008,JPO&INPIT
|
