THIN-FILM CAPACITOR WITH A FIELD MODIFICATION LAYER AND METHODS FOR FORMING THE SAME
摘要
<p>A method for forming a capacitor includes providing a metal-containing bottom electrode (12), forming a capacitor insulator (14) over the metal-containing bottom electrode (12), forming a metal-containing top electrode (18) over the capacitor insulator (14), and forming a dielectric-containing field modification layer (22) over the capacitor insulator (14) and at least partially surrounding the metal-containing top electrode (18). Forming the dielectric-containing field modification layer (22) may include oxidizing a sidewall (22) of the metal-containing field modification layer (18). A barrier layer (16) may be formed over the capacitor insulator (14) prior to forming the metal-containing top electrode (18).</p>
申请公布号
WO2007120354(A2)
申请公布日期
2007.10.25
申请号
WO2006US62388
申请日期
2006.12.20
申请人
FREESCALE SEMICONDUCTOR INC.;ROBERTS, DOUGLAS R.;LUCKOWSKI, ERIC D.;RAUF, SHAHID;VENTZEK, PETER L.G.
发明人
ROBERTS, DOUGLAS R.;LUCKOWSKI, ERIC D.;RAUF, SHAHID;VENTZEK, PETER L.G.