| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with which stable operation is expected without malfunction of a semiconductor device with low temperature assurance, even if a semiconductor device with high temperature assurance and the semiconductor device with low temperature assurance are stacked. <P>SOLUTION: A thermal conductor 8 is provided in a region except a mounting part of a semiconductor element 1b packaged on a surface of a substrate 3b of a semiconductor device 102 mounted on the uppermost stage among a plurality of stacked stages, and a heat sink 10 is thermally coupled to the substrate 3b via the thermal conductor 8 to dissipate heat. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
