| 发明名称 |
High reliability power module |
| 摘要 |
A high reliability power module which includes a plurality of hermetically sealed packages each having electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.
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| 申请公布号 |
US2007246812(A1) |
申请公布日期 |
2007.10.25 |
| 申请号 |
US20070789164 |
申请日期 |
2007.04.24 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
ZHUANG WEIDONG |
| 分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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