| 摘要 |
A method for manufacturing memory card structure comprises the steps of. Providing a carry has an upper surface, which is coated with adhered glue, and a lower surface. Providing a substrate has a first surface, which is formed with first electrodes, and a lower surface, a golden finger is formed on the substrate, and is electrically connected to the first electrodes. Providing a passive component is mounted on the first surface of the substrate. Separating the substrate and the carry. Providing a chip is mounted on the first surface of the substrate. Providing a plurality of wires is electrically connected the chip to the first electrodes of the substrate. Providing a compound resin is covered on the chip and wires.
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