发明名称 ELECTRONIC COMPONENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component device wherein electronic components are hermetically sealed in a package provided with a light transmission window and the light transmission window having an inclined face with an optional angle is accurately arranged. <P>SOLUTION: An electronic component 40 is mounted onto the bottom of the housing S of a package body 30 which is provided with the housing S inside and an opening 20x on its upper side, and a light transmission window 50 which allows light from the outside to enter the electronic component 40 is provided to block the opening 20x, so that the electronic component 40 is hermetically sealed. A pair of facing faces in the direction of light transmission are formed by a combination of a horizontal surface HS and an inclined surface IS, and the horizontal surface HS side is fixed onto the vicinity of the opening 20x of the package body 30, so that the light transmission window 50 is arranged in a manner to have the inclined surface IS to the light receiving surface of the electronic component 40. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281021(A) 申请公布日期 2007.10.25
申请号 JP20060102213 申请日期 2006.04.03
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KOIZUMI NAOYUKI
分类号 H01L23/02;H01L31/02 主分类号 H01L23/02
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