发明名称 MICROWAVE PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a new microwave plasma treatment device which is easy in control of generation location of plasma and can generate plasma with good uniformity and high strength at the arbitrary location on an object to be treated. <P>SOLUTION: The microwave plasma treatment device comprises a cylindrical vacuum chamber 5 to generate microwave plasma, a microwave source 2 and a waveguide 3 to introduce microwave energy into the vacuum chamber 5, a treated object support 7 installed in the vacuum chamber 5, and a conductor 8 installed in the vacuum chamber coaxially. The conductor 8 is installed so that one end face may be located in the vicinity of the treated object support 7 and an end part member 8b of the conductor 8 located on the treated object support 7 side is exchangeable. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007280877(A) 申请公布日期 2007.10.25
申请号 JP20060108713 申请日期 2006.04.11
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;JAPAN ATOMIC ENERGY AGENCY 发明人 YAMADA HIDEAKI;CHAYAHARA AKIYOSHI;MOKUNO YOSHIAKI;HORINO YUJI;SAKAMOTO KEIJI
分类号 H05H1/46;C23C16/511 主分类号 H05H1/46
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