发明名称 METHOD OF MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE PIECE AND PIEZOELECTRIC WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an SAW device piece which can allow the thickness of an anodic oxidation film formed on a reflector to be thicker than that of an anodic oxidation film formed on an IDT by simplifying a process of executing anodic oxidation. SOLUTION: The SAW device piece 10 is provided with the IDT 14 formed on one main surface of a piezoelectric substrate 12 and the reflectors 24 arranged so as to sandwich the IDT 14, wherein the anodic oxidation film 32 (32a, 32b) is formed on the surfaces of the IDT 14 and the reflectors 24. In the manufacturing method thereof, in the anodic oxidation process; anodic oxidation is executed while the film thickness of a pattern electrode for supplying current to the IDT 14 is made to be thinner than the film thickness of a pattern electrode for supplying current to the reflectors 24, the pattern electrode for supplying current to the IDT 14 is completely oxidized after a predetermined time elapses and the current supplied to the IDT 14 is cut, and the anodic oxidation process is continued after that, thereby supplying current only to the reflectors 24. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281708(A) 申请公布日期 2007.10.25
申请号 JP20060103503 申请日期 2006.04.04
申请人 EPSON TOYOCOM CORP 发明人 IIZAWA KEIGO
分类号 H03H3/08 主分类号 H03H3/08
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