| 摘要 |
The present invention relates to a package structure of light emitting device, comprising a light emitting diode disposed on a submount, wherein the light emitting diode comprises a first contact and a second contact respectively connected with a first conductive lead and a second conductive lead of the submount. The first conductive lead and second conductive lead of the submount are electrically connected with a print circuit board. As a result, the light emitting diode is electrically connected with the print circuit board without the wire bonding process, and the power can be supplied to the light emitting diode through the print circuit board. |
