| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a packaging structure capable of preventing electronic components from being damaged when delivering the electronic components, to provide a packaging method, and to provide a manufacturing apparatus and a packaging apparatus of a packaging structure. <P>SOLUTION: There are provided: a process S1 for sucking (holding) a surface 2A by a holding member 3 having a holding surface 15 that is harder than the surface 2A of a driver IC 2; and a process S3 for moving the driver IC 2 onto a movable stage 5 capable of supporting the driver IC 2, by sliding on the surface 2A of the driver IC2 and the holding surface 15 of the holding member 3. Thus, when for example the holding surface 15 and the surface 2A are brought into contact with each other and the driver IC 2 is slid to the holding member 3, the damage of the holding surface 15 in the holding member 3 is prevented for maintaining a state without any damage in the holding surface 15, and the driver IC 2 is in contact with the holding surface 15 of the holding member 3 without any damage and the drive IC 2 is slid, thus preventing the driver IC 2 from being damaged. <P>COPYRIGHT: (C)2008,JPO&INPIT |
