| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide printed circuit board which has high 180°copper foil peel strength and high repetitive bend resistance and is excellent in fine wiring formation property, and a polyimide printed wiring board using the printed circuit board. SOLUTION: For a copper foil joined polyimide printed circuit board, in the polyimide printed circuit board for which copper foil having a rough surface where projections are formed is joined to at least one surface of a non-thermoplastic aromatic polyimide resin film on the rough surface through a press-fixing polyimide resin layer obtained by imidizing polyamide acid, the D(diameter) of the projection is 10-100 nm and L(length)/D(diameter) is≥1.5. COPYRIGHT: (C)2008,JPO&INPIT |
