发明名称 POSTPROCESSING APPARATUS FOR GLASS SUBSTRATE WITH REDUCED THICKNESS
摘要 PROBLEM TO BE SOLVED: To provide a postprocessing apparatus with which a glass substrate for an FPD, of which the thickness is more and more reduced, is suitably handled. SOLUTION: The postprocessing apparatus EQU receives a stuck glass substrate GL of which the thickness is reduced with chemical polishing and conducts postprocessing thereafter. The postprocessing apparatus is constructed by being provided with a conveyance route using a roll RL to convey the glass substrate, an introducing section 1 to pass the received glass substrate to the conveyance route, and a deriving section 5 to receive and derive the glass substrate GL from the conveyance route. The introducing section 1 has a placing section 10 to hold the glass substrate, and a driving section 20 to erect and drop the placing section 10, and performs switching between the dropping state and the erecting state of the placing section 10 in accordance with the reciprocating motion of the driving section 20. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007279451(A) 申请公布日期 2007.10.25
申请号 JP20060106644 申请日期 2006.04.07
申请人 NISHIYAMA STAINLESS CHEM KK 发明人 NISHIYAMA TOSHIHIRO
分类号 G02F1/1333;B65H5/04;C03C15/00;G09F9/00 主分类号 G02F1/1333
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