| 摘要 |
In the conventional technology, a region of larger data rate causes a varied level of the light exposure in the lithographic operation in the process for manufacturing the semiconductor device, causing a problem of allowing narrower process window. A semiconductor device includes interconnects (first interconnects) elongating along a first direction in a substrate surface of the substrate (transverse direction in the diagram), interconnects (second interconnects), elongating along the interconnects, and being spaced apart from the interconnects in plan view, and slit vias (slit-shaped via plugs), elongating along a second direction (longitudinal direction in the diagram) of directions in the substrate surface of the above-described substrate, which is a direction normal to the first direction, and being capable of electrically coupling the interconnect to the interconnect.
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