| 摘要 |
<p>Electrolytes for the electroplating of copper comprising, as inhibitor, a poly(alkylene-biguanide) salt. The inhibition developed by poly(alkylene-biguanide) salts is conditioned by the concentration of an accelerator on the surface of the copper. The surfactancy of poly(alkylene-biguanide) salts enables them to be instantly transferred from the electrolyte/air interface to the electrolyte/copper interface during contact between the cathode and the electrolyte. The electrolytes according to the invention are suitable for obtaining smooth and bright electroplated coatings and for depositing copper on surfaces having submicron-scale concavities useful in microelectronics.</p> |
