| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card that can be joined at a low temperature by enhancing joining strength between an IC module and an antenna without changing a manufacturing process. <P>SOLUTION: Terminal surface parts of the antenna and the IC module are formed by applying etching treatment to metal foil, and the width of a boundary appearing when antenna ends 2a and 2b and terminal surfaces 4a and 4b are connected is set to be ≥0. 1 mm and ≤2. 0 mm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
