| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition excellent in low dielectric constant, low dielectric loss tangent, compatibility and heat resistance, to provide a phenoxy resin used for the resin composition, and to provide a coating material composition, adhesive agent composition, adhesive film, prepreg, resin-clad copper foil and multilayer printed wiring board using the resin composition. SOLUTION: There are provided the resin composition containing a phenoxy resin (A) having a naphthalene skeleton and a structure wherein the hydrogen atoms of hydroxyl groups are substituted by acyl groups and having a weight average mol.wt. of 5,000-200,000, and a solvent (B); the coating material composition, adhesive agent composition, adhesive film, prepreg, resin-clad copper foil and multilayer printed wiring board containing the resin composition; and the phenoxy resin having the structure represented by general formula (1) and a weight average mol.wt. of 5,000-200,000. COPYRIGHT: (C)2008,JPO&INPIT |
