| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining device and a joining method, by which more excellent joining is conducted in a short period of time. SOLUTION: A joining device 10 has: a collet 62 for simultaneously supporting six solder balls B by suction at an intake/exhaust port 98; a transfer device means, which simultaneously transfers the six solder balls B supported by the collet 62 to electrodes E1, E2, and which consists of a y-axis motor 32, an x-axis motor 56, a z-axis motor 60 for a collet, aθ-axis motor 34, and the like; and a heating device, which simultaneously heats the six solder balls B transferred to the electrodes E1, E2, and which is provided with a laser unit 70 and an optical fiber 68. COPYRIGHT: (C)2008,JPO&INPIT
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