INDUCTANCE COMPONENT

摘要

Provided is an inductance component having high reliability without having stress locally applied, even under a condition where heat is applied to the entire component, such as in solder mounting. The inductance component is provided with a base body (5), a coil (6) formed in the base body (5) and terminals (7, 8) electrically connected to the coil (6). Magnetic layers (9A, 9B) arranged substantially parallel to the winding flat surface of the coil (6) are formed in the base material (5), and the entire magnetic layers (9A, 9B) are covered with a material having a uniform heat expansion/contraction rate.