METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING DISPLAY, AND DEVICE FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To manufacture a predetermined wiring board having a multi-layer structure by suppressing the new occurrence of electric leak.

SOLUTION: This method for manufacturing a wiring board comprises a wiring pattern formation process; a position/area inspection process for detecting the plane position and area of a defect; and a procedure selection process for selecting a correction procedure based on the rate of the plane areas of the defect and any of conductive members overlapped with the defect. In this procedure selection process, only when the rate of the plan areas is a reference value or less, the correction procedure for removing any defect by emitting a short pulse width laser beam whose pulse width is 10 pico seconds or less is selected so that a wiring board can be manufactured.

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