| 摘要 |
A method of cleaning a substrate within a controlled environment includes placing the substrate into a high pressure vessel. The high pressure vessel is then supplied with a dense fluid under pressure. The dense fluid is contacted with the substrate for a selected period of time to at least partially remove a contaminant contained on the substrate. After the selected period of time, the vessel is depressurized to at least partially convert the dense fluid into a vapor. The vapor is then subjected to an energy field to form a plasma within the vessel which is used to treat the substrate for a second selected period of time. The thus cleaned substrate is then removed from the vessel.
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