| 摘要 |
The object of the invention is a power inverter, the bottom of the housing ( 1 ) of the power inverter being configured to be stepped, cooling bodies ( 10, 11 ) being disposed on the exterior face of the stepped bottom, at least two printed circuit boards ( 6, 8 ) that overlap each other and communicate with the respective one of the cooling bodies ( 10, 11 ) through semiconductor components being provided.
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