PROCESS AND APPARATUS FOR REMOVING RESIDUES FROM SEMICONDUCTOR SUBSTRATES,申请号WO2005US05587-传众专利搜索

发明名称	PROCESS AND APPARATUS FOR REMOVING RESIDUES FROM SEMICONDUCTOR SUBSTRATES
摘要	The present invention generally relates to a system for cleaning substrates. More particularly, the present invention relates to process(es) for effecting chemical removal of residues from semiconductor substrates, including silicon wafers, using a system of reactive reverse micelle(s) or microemulsions in a densified carbon dioxide matrix. Various reactive chemical agents in the reactive micelle system may be used to effect cleaning and removal of etch and metal residues to levels sufficient for commercial wafer production and processing.
申请公布号	WO2005081289(A3)	申请公布日期	2007.10.25
申请号	WO2005US05587	申请日期	2005.02.15
申请人	BATTELLE MEMORIAL INSTITUTE;FULTON, JOHN, L.;GASPAR, DANIEL, J.;YONKER, CLEMENT, R.;YOUNG, JAMES, S.;SCOTT, ALAN, LEA;ENGELHARD, MARK, H.	发明人	FULTON, JOHN, L.;GASPAR, DANIEL, J.;YONKER, CLEMENT, R.;YOUNG, JAMES, S.;SCOTT, ALAN, LEA;ENGELHARD, MARK, H.
分类号	H01L21/311;B08B7/00;C11D1/12;C11D1/14;C11D1/34;C11D11/00;H01L21/02;H01L21/306;H01L21/768	主分类号	H01L21/311
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