| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable electronic circuit module about which a wiring failure does not occur, which is caused by air bubbles in a resin housing in a reflow soldering process after it is mounted on a mother board. <P>SOLUTION: An adequate amount of uncured resin (e.g., molten resin) is put into a recess of a forming die. An IC chip 3 and a group of various electronic parts 4, packaged on a principal surface 2a of a circuit board 2, are turned downward and put into the recess, and then, the resinous material in the recess is cured to make a resin housing 5, thereby producing an electronic circuit module 1 that has a clearance 6 with a predetermined spacing (0.1 mm or more) between the resin housing 5 and the circuit board 2. The upper side 5a of the resin housing 5' is composed of a flat surface approximately parallel to the principal plane 2a of the circuit board 2, and this resin housing 5 seals at least the upper part of the IC chip 3 and the group of various electronic parts 4. Further, the clearance 6 has a communicative connection with the outer space. <P>COPYRIGHT: (C)2008,JPO&INPIT |
