| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately inspect the thickness of a flux film to be transferred to a solder ball electrode of an electronic component by simplified structure. <P>SOLUTION: An electronic component provided with a ball electrode is sucked and picked up by a nozzle 101, and the solder ball electrode of the sucked electronic part is immersed in a flux unit 108 to transfer flux thereto. The surface on which the solder ball electrode of the electronic component is illuminated by an illumination 103, and the illuminated solder ball electrode illuminated by the illumination in the photographing part 104 is photographed to acquire a video signal. At the same time, the luminance of the solder ball electrode is detected by a luminance detector 105, and when the detected luminance of the solder ball electrode is higher than a predetermined threshold value, it is judged to be flux transfer failure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
