发明名称 NON-CONTACT IC TAG HAVING IC CHIP BREAKDOWN PREVENTION STRUCTURE, CONNECTING ELEMENT OF THE NON-CONTACT IC TAG, AND MANUFACTURING METHOD OF THE NON-CONTACT IC TAG CONNECTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag for preventing an IC chip of the non-contact IC tag from being broken by external force applied, and also to provide a manufacturing method of the tag. <P>SOLUTION: A non-contact IC tag 1 having an IC chip breakdown preventing structure includes a dipole antenna 2 formed on one face side of a base film 11 and an IC chip 3 mounted on the antenna 2, and also has a surface protective sheet mounted thereon. Two sheets of strip-like structures 10a, 10b are arranged at intervals, so as to form parallel grooves 9 orthogonal to the length direction of the antenna 2, on both sides of the IC chip 3, and the IC chip 3 is positioned in the grooves 9. The IC tag 1 may be formed as an IC tag connecting element, and the protective sheet may not be necessary. The strip-like structures 10 may be papers or plastic films having uniform thickness of 50 &mu;m to 250 &mu;m. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007279782(A) 申请公布日期 2007.10.25
申请号 JP20060101315 申请日期 2006.04.03
申请人 DAINIPPON PRINTING CO LTD 发明人 OGATA TETSUJI
分类号 G06K19/077;G06K19/07 主分类号 G06K19/077
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