| 摘要 |
PROBLEM TO BE SOLVED: To provide a device, a method and a system for mounting solder balls which is superior in uniformity of bump height and can be applied for solder balls of various materials/sizes without requiring advanced technique for alignment of a mounting position for the solder ball. SOLUTION: A solder ball mounting device 100 comprises a conveying means 40 for conveying a wafer 41, a ball reservoir means 10 for storing a plurality of solid-state solder balls 11, a solder ball charging means 12 for charging the solder ball 11, a photo conductor 4 for moving the solder ball 11 to right above an electrode 42 on the wafer 41 by sticking to the surface of the solder ball 11, an exposing means 9 for discharging electric potential of a position corresponding to the electrode 42 in the surface of the photo conductor 4 by exposing (laser beam irradiating, etc.), and CPU 2 and 6 for controlling conveying speed of the conveying means 40, moving speed of the photo conductor 4 and exposure by the exposing means 9. COPYRIGHT: (C)2008,JPO&INPIT
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