| 摘要 |
An optical transmission module of the invention uses a semiconductor chip forming an optical modulator integrated laser on a semi-insulating semiconductor board. An input transfer line and an anode electrode of an optical modulator element are connected by a first bonding wire. The anode electrode of the optical modulator element and one of the ends of a terminal resistor element are connected by a second bonding wire. A cathode electrode of the optical modulator element and the other end of the terminal resistor element are connected by a third bonding wire. The cathode electrode of the optical modulator element and a ground electrode are connected by a fourth bonding wire. A joint portion between the first bonding wire and the input transfer line is arranged on an opposite side to a joint portion between the fourth bonding wire and the ground electrode while interposing the semiconductor chip between them.
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