| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can prevent the separation of an enforcing sheet from an adhering surface in a semiconductor process subsequent to the bonding together of the surface of a semiconductor wafer and the enforcing sheet. SOLUTION: In the semiconductor device manufacturing method after the surface side of a semiconductor substrate 1 is processed, a photoresist film 7 is coated for flattening surface roughness formed on the surface of the semiconductor substrate 1, and the back of the semiconductor substrate 1 is ground while the enforcing sheet 4 is bonded together to the flat surface of the photoresist film 7 via an adhesive agent 5. COPYRIGHT: (C)2008,JPO&INPIT
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