| 摘要 |
An alloy film is fabricated, on the face of a heat exchanger for an integrated circuit, by a process that dispenses various liquids onto the heat exchanger's face. To prevent those liquids from falling off of the heat exchanger's face onto other components which hold the heat exchanger on a frame, the process begins by combining the heat exchanger into an assembly that includes a retainer and a compliant member. The retainer catches any liquids that fall off the heat exchanger's face, and the compliant member forms a seal between the heat exchanger and the retainer which prevents the liquids from leaking onto the other components. |
