发明名称 ELECTRONIC COMPONENT CONNECTION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a connection device that is adaptable to both welding and soldering connections, is simply and quickly practicable, and flexibly connects a plurality of components. <P>SOLUTION: The connection device 1 that conductively connects electronic components 3a/b, 4, 5, 6 to a substrate 2, is formed as a film composite material including at least one sheet of insulating film 14 and two sheets of conductive films 10, 12. The film composite materials 10, 12 are formed as a layered structure where the insulating films and conductive films are alternately arranged. In this case, at least one sheet of conductive film is formed, and a conductive track is thus formed. Furthermore, at least one sheet of the conductive films in a major region of the film composite material contains a first metal and has at least one film portion with a second metal layer thinner than the first metal. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281452(A) 申请公布日期 2007.10.25
申请号 JP20070070666 申请日期 2007.03.19
申请人 SEMIKRON ELEKTRONIK GMBH & CO KG 发明人 GOEBL CHRISTIAN;AUGUSTIN KARLHEINZ;STOCKMEIER THOMAS
分类号 H01L25/07;H01L25/18;H05K1/18 主分类号 H01L25/07
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