| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved carrier for a both-sided polisher, used in polishing a Si wafer or a GaAs wafer. <P>SOLUTION: The carrier for a both-sided polisher is made of carbon laminated material obtained by alternately stacking carbon layers of unidirectional fiber. When the carrier is made by die cutting from a plate manufactured using the carbon laminated material obtained by alternately stacking the carbon layers of unidirectional fiber, a thickness error is small, so that a wafer having good flatness by polishing is made. <P>COPYRIGHT: (C)2008,JPO&INPIT |
