| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact assembly, of which the shape of the vertical probe formed in a resin film, is a cantilever structure. SOLUTION: In this contact assembly for inspecting a circuit of a semiconductor chip, a conductive part, including the vertical probe 12, is formed on the resin film by etching a copper foil, using the resin film bonded with the copper foil, and the plurality of sheets of resin films with the vertical probe are collectively laminated to bring tip parts of the vertical probes 12 into contact with the electrode pads of the semiconductor chip. The conductive part, including the vertical probe 12, forms a parallelogram link 16 having a parallel spring 15, in the contact assembly. COPYRIGHT: (C)2008,JPO&INPIT
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