发明名称 Ceramic foam electronic component cooling
摘要 In an exemplary apparatus for cooling an electronic component, a housing defines an inlet port and an exhaust port and a foam member is disposed within the housing. The foam member has a shape that conforms to a shape of at least one surface of an electronic component such that the foam member is receivable thereon in thermal communication. The foam member has a pore size of no more than around 50 micrometers and a porosity of at least around 80 percent. The foam member is arranged within the housing such that coolant is flowable through the foam member. Pore size may be around 35 micrometers and porosity may be around 90 percent. Foam may be a ceramic foam that includes silica, aluminum oxide, and aluminum borosilicate fibers. In an application, at least one exemplary apparatus may be received in thermal communication on an upper case of an electronic chip.
申请公布号 US2007247808(A1) 申请公布日期 2007.10.25
申请号 US20060407433 申请日期 2006.04.20
申请人 THE BOEING COMPANY 发明人 BEHRENS WILLIAM W.;TUCKER ANDREW R.
分类号 H05K7/20 主分类号 H05K7/20
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