发明名称 SINGLE PASS, DUAL THICKNESS ELECTROPLATING SYSTEM FOR HEAD SUSPENSION COMPONENTS
摘要 A method for simultaneously electroplating exposed conductor regions on both sides of a disk drive suspension component by providing an electroplating system having a bath of electroplating solution with first and second anodes in the bath. The suspension component is positioned in the bath of electroplating solution between the first and second anodes. A first electroplating current is produced between the first anode and the exposed conductor regions on the first surface of the component. A second electroplating current is produced between the second anode and the exposed conductor regions on the second surface. Layers of conductive material are thereby plated onto the exposed conductor regions on both sides of the component. By controlling parameters of the first and second plating currents, such as time and magnitude, the layers of conductive material can be plated to the same or different thicknesses on the opposite sides of the conductors.
申请公布号 WO2006081321(A3) 申请公布日期 2007.10.25
申请号 WO2006US02698 申请日期 2006.01.25
申请人 HUTCHINSON TECHNOLOGY INCORPORATED;PETER, TODD A. 发明人 PETER, TODD A.
分类号 C25D17/00 主分类号 C25D17/00
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