| 摘要 |
PROBLEM TO BE SOLVED: To realize improvements in the efficiency of a process and the reliability by enabling the unpreferred adhesion of an underfill resin to be avoided except a predetermined portion, in a range in which the thickness of the semiconductor chip is 150 μm or less and enabling a fillet of a preferred shape to be easily formed in a semiconductor device in which a semiconductor chip is bump-connected to a circuit substrate. SOLUTION: The pattern of an insulating film is provided on the surface of the circuit substrate so as to surround a region for placing the semiconductor chip on the circuit substrate. A plurality of grooves extended from the side edge approaching the region for placing the semiconductor chip toward outward are formed on the pattern of this insulating film. COPYRIGHT: (C)2004,JPO&NCIPI |
