ANISOTROPIC CONDUCTIVE FILM COMPOSITION FOR HIGH RELIABILITY

摘要

A radical curing anisotropic conductive film composition and an epoxy curing anisotropic conductive film composition are provided to prevent the short between circuits, to lower initial contact resistance and to improve confidence. A radical curing anisotropic conductive film composition comprises a thermoplastic resin; at least one kind of resin selected from a poly(amid acid) resin and a polyimide resin represented by the formula; at least one kind of radical curing unit selected from (meth)acrylate oligomer and monomer; a radical initiator; and a conductive particle. An epoxy curing anisotropic conductive film composition comprises a thermoplastic resin; at least one kind of resin selected from a poly(amid acid) resin and a polyimide resin represented by the formula; an epoxy resin selected from bisphenol, novolac, glycidyl, aliphatic and alicyclic epoxy resins; a powder curing agent selected from an acid anhydride, an amine, an imidazole and a hydrazide; and a conductive particle.