| 摘要 |
A process for applying a crushed gelled composition is provided to fabricate electronic appliances with high reproducibility and uniformity by using the crushed gelled composition having a high viscosity while maintaining a semiconductor polymer at a low concentration. A process for applying a crushed gelled composition comprises the steps of: (a) providing a composition capable of gelling containing a semiconductor polymer capable of gelling and a liquid, wherein the polymer is present in the liquid at a low concentration; (b) gelling the composition to form a gelled composition; (c) crushing the gelled composition to form a fluidizable crushed gelled composition, wherein the fluidizable crushed gelled composition has at least ten times higher viscosity than the viscosity of the liquid; and (d) applying the fluidizable crushed gelled composition in a liquid state.
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