| 发明名称 |
Semiconductor device and seconductor device fabrication method |
| 摘要 |
<p>There is provided a semiconductor device in which a light emitting element (107) is mounted on a substrate (101, 101a), having a bonding wire (104) which is connected to the light emitting element, and a through electrode (103) which is connected to the bonding wire and is formed in such a manner as to pass through the substrate at a position lying directly below a connecting portion with the bonding wire.</p> |
| 申请公布号 |
EP1848044(A2) |
申请公布日期 |
2007.10.24 |
| 申请号 |
EP20070008012 |
申请日期 |
2007.04.19 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HIGASHI, MITSUTOSHI;MURAYAMA, KEI;SHIRAISHI, AKINORI;TAGUCHI, YUICHI |
| 分类号 |
H01L33/00;H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
| 代理机构 |
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代理人 |
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